ASA’s GPU Computing Solutions include the latest GPU technologies capable of running diverse AI, HPC, and accelerated computing workloads and Intel® Xeon® Scalable processors to provide a seamless performance foundation for the data-centric era.
Products
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Supports up to 4 GPUs
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Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors
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16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM
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6 PCI-E 3.0 x16 slots (FHFL), 1 PCI-E 3.0 x8 (in x16) slot (LP)
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8 Hot-swap 2.5" SAS/SATA drive bays, 2 Hot-swap 2.5" SATA/NVMe drive bays
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1 SIOM for flexible Networking
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5x 80mm heavy duty fans with optimal fan speed control
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2000W (1+1) Redundant Power Supplies Platinum Level (94%)
Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
3 x 3.5" hot-swap SATA drive bays
2 SATADOM ports SATA (6Gbps); 3 slots per node; RAID 0, 1, 5 support
Applications:
High Performance Computing
AI/Deep Learning Training
High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA
Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)
Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect
Dual AMD EPYC™ 7003/7002 Series Processors
Applications:
AI/ML, Deep Learning Training and Inference
High-performance Computing (HPC)
Cloud Computing
Research Laboratory/National Laboratory
Autonomous Vehicle Technologies
Molecular Dynamics Simulation
Supports 3rd Generation Intel® Xeon® Scalable Processors
Supports NVIDIA HGX™ A100 with 8 x SXM4 GPU
Up to 600GB/s GPU to GPU interconnection
6 x 2.5" Gen4 U.2 NVMe/ SATA hot-swappable HDD/SSD bays
Applications:
High Performance Computing
AI/Deep Learning Training
AMD EPYC™ 7003 series processor family
Supports NVIDIA HGX™ A100 with 8 x SXM4 GPU
Up to 600GB/s GPU to GPU interconnection
6 x 2.5" Gen4 U.2 NVMe/ SATA hot-swappable HDD/SSD bays
Applications:
AI
AI Training
AI Inference
HPC
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Supports up to 4 GPUs
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Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)
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16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM
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4 PCI-E 3.0 x16 (double-width) slots, 2 PCI-E 3.0 x16 (single-width) slots, 1 PCI-E 3.0 x4 (in x8) slot
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8 Hot-swap 3.5" drive bays
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2x 10GBase-T LAN ports
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1 VGA, 2 COM, 5 USB 3.0
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4 Heavy duty fans, 4 exhaust fans, and 2 active heatsink with optimal fan speed control
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2200W Redundant Power Supplies Titanium Level (96%)