AIC

AIC is a leading provider of both standard off-the-shelf and OEM/ODM server and storage solutions. With over 25 years of experience in mechanical, electronic, system-level engineering, as well as a dedication to innovation and customer satisfaction, AIC's products are highly flexible and customizable to any form factor.

Product Highlights

1U 4-Bay Storage Server

The SB101-A6 supports dual 3rd Gen Intel® Xeon® Scalable processors, 4 x 3.5" hot-swappable and 2x 2.5" internal OS HDD/SSD bays to provide high storage density.

Supports 3rd Gen. Intel® Xeon® Scalable processors (codename Ice Lake)
Onboard Baseboard Management Controller for system management and IPMI control
Front-to-back airflow and easy swap redundant fans to provide optimal thermal conditions
Dedicated BMC management port

Technical Specs
Processor Support	Intel® Ice Lake-SP Processors Supports CPU TDP up to 270W
Chipset Support	Intel® C621A series PCH
System Memory	DDR4 3200/2933/2666/2400 (1DPC/2DPC) MHz Total 16+16 DIMM slots (2DPC)) Up to 12TB 3DS ECC RDIMM/LRDIMM Intel® Optane™ Persistent Memory 200 Series support
Expansion Slots (PCIe 4.0)	2 PCIe4.0 x16 1 OCP NIC 3.0
Drive Bays	External : 3.5"/2.5" hot swap x 4 (6G SATA/12G SAS/ PCIe x4 NVMe) Internal : 2 x 2.5" OS
Backplane	1 x 4-port SATA/SAS/NVMe backplane with 1 x SFF-8643 + 2x SFF-8654(Slimline 8i) connectors
Dimensions (W x D x H)	mm: 438 x 800 x 43.5 inches: 17.2 x 31.5 x 1.7

4U 102-Bay Ultra-Density Storage Server

The SB405-VL top-loading storage server includes built-in system MB, dual 2nd Gen Intel® Xeon® Scalable processors. Its flexible PCIe 3.0 extension design for SAS HBA / SAS RAID / Ethernet / FC cards with 2x PCIe X16 slots and 1xOCP Mezzanine provide significant I/O performance. Plus front-to-back airflow and hot swap redundant fans provide optimal thermal conditions.

Supports 2nd Gen. Intel® Xeon® Scalable processors (Cascade Lake Refresh/Cascade Lake/Skylake)
Flexible I/O usage with MAX I/O to support up to 1 OCP x16 Mezzanine card V2.0
Onboard Baseboard Management Controller for system management and IPMI control
Front-to-back airflow and hot swap redundant fans to provide optimal thermal conditions

Technical Specs
Processor Support	Intel® Xeon® Scalable Processors (Cascade Lake Refresh/Cascade Lake/Skylake) Support CPU TDP up to 150W
Chipset Support	Intel® Lewisburg C620 series PCH
System Memory	6 x memory channels per CPU, 2 channels with 2DPC + 4 channels with 1DPC 16 x DIMM slots support: DDR4 2933/2666/2400MHz RDIMM/LRDIMM Intel® Optane™ DC Persistent Memory (Apache Pass) support
Expansion Slots (PCIe 3.0)	2 x PCIe Gen3 slots 1 x OCP Mezz. V2.0 supports PCIe Gen3 x16 1 x high-density connector supports 16 + 8 lanes of PCIe Gen3
Drive Bays	Internal: 102 x 3.5" hot swap (Top-Loading) 2 x 2.5" hot swap (7mm, Top-Loading) 2 x M.2(NGFF) / M-Key / 2280 / Supports SATA or PCIe x2
Backplane	3 x 24-port 12Gb SAS backplanes with 36-PHY expander and 2 x 8i SAS slimline connectors 1 x 30-port 12Gb SAS backplane with 40-PHY expander and 2 x 8i SAS Slimline connectors
Dimensions (W x D x H)	mm: 434 x 1050 x 176 inches: 17.1 x 41.3 x 7

2U 4-Node Hybrid Storage Server

The HP201-AG multi-node HCI server that provides high compute density and high storage capacity and is optimized for hyper-converged applications. It comes with 24x 2.5" NVMe/SAS/SATA, 8x 2.5" SATA bays with support for 1x AMD® EPYC®

Supports AMD EPYC™ 7003/7002/7001 processor
Maximizing the use of the numbers of memory, add-on cards and drives in one single system
Onboard Baseboard Management Controller for system management and IPMI control
3 x PCIe x16 extensions on each node
Front-to-back airflow and easy swap redundant fans to provide optimal thermal conditions

Technical Specs
Processor Support	Single AMD EPYC™ 7003/7002/7001 processor Supports CPU TDP up to 280W (Support by EPYC™ 7003 CPU)
Chipset Support	AMD EPYC™ SOC
System Memory	DDR4 3200/2933MHz RDIMM/LRDIMM Total 8 memory slots; 8 channels Supports up to 2TB (support by EPYC™ 7003/7002 CPU) Supports NVDIMM feature
Expansion Slots (PCIe 4.0)	2 x16 slots (LP) 1 x16 OCP Mezzanine V2.0
Drive Bays	External: 24 x 2.5" hot-swap (6 x NVMe/SAS/SATA per node) Internal: 8 x 2.5" hot-swap(2 x SATA per node) (Option) 2 x M.2(NGFF) / M-Key / 2280 / Supports SATA or PCIe x2
Backplane	1 x 24-port NVMe/SAS/SATA backplane with high-density connectors to bridge riser board
Dimensions (W x D x H)	mm: 438 x 780 x 87.5 inches: 17.2 x 30.7 x 3.5

4U 108-Bay 12Gb/s SAS JBOD

Ideal for high-availability storage and high-performance appliances, the 4U 108-bay 12Gb/s SAS JBOD supports 108 x 3.5" drives with single or dual expanders.

Intelligent Enclosure Management
Individual drive power management
Hot swap design for easy maintenance and management
Enclosure Cable Management Kit
Tool-less drive trays

Technical Specs
Drive Supported	Drive Interface : 12Gb & 6Gb SAS if using dual expanders 12Gb & 6Gb SAS/SATA if using single expander Form Factor: 3.5"
General	Number of Expander: Single/Dual Expander Chip: Broadcom SAS35X48 Host/Expansion Interface: 4 x Mini SAS HD (SFF-8644) per expander module
Electrical & Environment	AC Input: 200~240V,50/60Hz,15A Operating Environment: Temperature 0°C to 35°C Relative humidity 20% to 80% Non-operating Environment: Temperature -20°C to 60°C Relative humidity 10% to 90%
Hot-swap & Redundancy	Disk Drive: 108 bays Cooling: 8 x 60x56mm hot swap fans 1 x 40x56mm fan per expander module Power Supply: 2000W 1+1 hot swap redundant 80+ Platinum Socket type: C20 (Power code type: C19) Power Entry: Dual AC Inlet Expander Modules: Dual expanders (option)
Physical Specification	Dimensions (W x D x H): mm: 434 x 1050 x 176 434 x 1273 x 176 (with CMA) inches: 17 x 41 x 7 17 x 50 x 7 (with CMA)

Product Highlights

1U 4-Bay Storage Server

Technical Specs

4U 102-Bay Ultra-Density Storage Server

Technical Specs

2U 4-Node Hybrid Storage Server

Technical Specs

4U 108-Bay 12Gb/s SAS JBOD

Technical Specs

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