Processor (per node)
CPU
Dual 4th Gen Intel® Xeon® Scalable Processors, CPU TDP up to 350W
Cores
2 x LGA 4677, socket E
On-Board Devices (per node)
Chipset
Intel® C741 Chipset
LAN
1 x Dedicated management port
Memory (per node)
System Memory
16 x DIMM slots
DDR5 memory supported only
8-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz
Drive Bays (per node)
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, NVMe from CPU_1
SAS card is required for SAS devices support
Power Supply
Dual 3000W (240V) 80 PLUS Titanium redundant power supply
Expansion Slots (per node)
Riser Card CRSH01U
1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0
Optional EDSFF riser card for 2 x EDSFF/M.2 slots
1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0
Optional 1 x M.2 slot (CMTP061)
M-key
Supports 2280/22110 cards
Operating Temperature Range
Non-operating temperature
-40°C to 60°C
Non-operating humidity
20%-95% (non-condensing)
Dimensions
Length / Depth
33" (840mm)
